India’s cupboard has authorized a brand new semiconductor plant, a joint enterprise between HCL Applied sciences and Taiwan’s Foxconn, costing 37.06 billion rupees ($435 million), info minister Ashwini Vaishnaw mentioned on Wednesday.
The plant, which shall be situated close to the Jewar airport within the northern state of Uttar Pradesh, is designed for a capability of 20,000 wafers per thirty days and might produce 36 million show driver chips, Vaishnaw mentioned at a cupboard briefing in New Delhi.
The ability, which is the sixth plant authorized beneath the India Semiconductor Mission, will start business manufacturing in 2027, he added.
Indian Prime Minister Narendra Modi has made chipmaking a prime precedence for India’s financial technique to spice up its position in international electronics manufacturing, however the nation presently has no operational chipmaking facility.
Earlier this month, Reuters reported that Indian billionaire Gautam Adani’s group paused discussions with Israel’s Tower Semiconductor for a $10 billion (roughly Rs. 85,402 crore) chip mission after an inner assessment raised uncertainties round business demand.
The Maharashtra state authorities had initially introduced approval for the Adani-Tower enterprise in September, which was anticipated to provide 80,000 wafers month-to-month and create 5,000 jobs.
In 2023, Foxconn’s proposed $19.5 billion (roughly Rs. 1,66,534 crore) joint enterprise with Indian conglomerate Vedanta collapsed amid Indian authorities issues over escalating mission prices and delays in approving incentives.
Regardless of setbacks, different chip initiatives stay beneath improvement, together with an $11 billion (roughly Rs. 93,942 crore) chip manufacturing and testing facility by the Tata Group and a $2.7 billion (roughly Rs. 23,058 crore) chip packaging plant by US-based Micron.
© Thomson Reuters 2025
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